Stauf SMP 930 Polymer adhesive light 18 kg

Stauf SMP 930 Polymer glue light 18 kg,

Elastic one-component SMP parquet adhesive. Solvent-free glue, does not cause swelling of wood. Glue residues are easy to remove.

special features,

hard elastic, stress-relieving parquet bonding

can be used on almost all surfaces without priming

glue residues are easy to remove

water and solvent free, no swelling of the wood

Permissible floor coverings,

Mosaic strips on edge from 16 mm thickness according to EN 14761

Solid planks with a width/thickness ratio of 7:1

Multi-layer parquet according to DIN EN 13489

Mosaic parquet DIN EN 13488

Unfinished solid parquet strips 14 mm thick according to DIN EN 13226 max size 75 x 600 mm

Permitted substrates,

Concrete C 25 / 30 according to DIN 1045 (rough surface)

Calcium sulphate (anhydrite) cast floors

STAUF parquet leveling compounds

Chipboard (P4 to P7), OSB (OSB/2 to OSB/4)

Cement screeds

Mastic asphalt after spreading with STAUF VEP 195

Control of the substrate,

Before installation, the substrate must be checked in accordance with the DIN 18356 standard and/or the applicable national regulations. The subfloor must, among other things, be resistant to pressure and stretch, free of cracks, permanently dry, flat, sufficiently firm on the surface, free of dust and may not show any residues of anti-adhesion layers, stone dust, etc. Furthermore, porosity and sufficient roughness of the subfloor must be assessed. the surface. With cement (cast) screeds and calcium sulphate (cast) screeds, it must be checked whether they are sufficiently absorbent and dry. Ambient temperature, humidity as well as the temperature of the subfloor must be checked.

Substrate preparation,

The preparation of the subfloor is important to ensure that it is ready for installation, ie absolutely dust-free, firm, sufficiently rough, absorbent where necessary, flat, permanently dry and without cracks. To process this, preparatory work may be necessary (sweeping, vacuuming, brushing with a brush machine, sanding or sanding, milling, shot blasting), depending on the type of subfloor and its condition. Cracks and joints, with the exception of edge expansion joints and other building construction joints, must be permanently closed with STAUF Cast resin and the associated hooks. Holes and indentations can be filled with a form-retaining leveling product from Stauf. To obtain a flat, absorbent and sufficiently rough subfloor, it may be advisable to level with a designated STAUF leveling product.

Processing,

Apply the adhesive evenly with the appropriate notched trowel with prescribed serrations in a smooth motion, avoiding glue pools and excess thickness. Apply the parquet in the adhesive bed within the specified time with a short sliding movement and press the floorboard firmly. Particularly with unfinished parquet, care must be taken not to slide glue between the joints. Glue in the joints can react negatively with later finishing products Glue in the joints can react negatively with later finishing products. Adhesive residues can be removed with the appropriate STAUF stain remover, depending on the curing time. Assess the expected result in an inconspicuous place or on a leftover piece of factory-finished parquet. Cured adhesive residues can be completely removed mechanically relatively easily; it is true that too long an effect on finished parquet should be avoided in order not to get any markings.

load capacity,

The load capacity depends on the ambient climate and the amount applied.
Further directions

The adhesive hardens through a reaction with moisture. The moisture is obtained from the ambient air, the wood or the substrate. A higher ambient temperature accelerates the curing. The thicker the adhesive bed, the longer the curing time is. Plasticizers in adhesives can affect the consistency of mastic asphalt screeds. Particularly with parquet strips without a tongue-and-groove connection, there is a risk that plasticizers will damage the parquet varnish. With solid planks and solid parquet from a width-thickness ratio of 1:7, with thinner solid wood of format 1:5 (e.g. 10 mm parquet) or when laying nervous wood types on underfloor heating, it can be useful to glue with hard glue , e.g. STAUF SPU 570, STAUF PUK 446 or PUK 455, to prevent shearing.

-TECHNICAL INFORMATION-